Most customers need competent backend services even after the initial process of design, prototyping and manufacture of the chip is complete. Chipsolve has a structured procedure to deliver essential backend services to customers:
Best in the industry wafer bumping services, with high speed package services, highly efficient supply management and optimal cycle time
Wide range testing services ranging from logic, memory to mixed-mode
Maximum customer interaction and intervention throughout the supply chain to ensure close compliance with customer requirements
By offering backend services integrated into our portfolio, Chipsolve customers can take advantage of shorter time-to-market, advanced packing services and testing services.
